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Configuration File Documentation

The configuration file must obey a certain structure in order to be parsed correctly. An example for a configuration file can be seen in SampleConfig.txt. The configuration file is parsed line by line and each successfully parsed line is executed immediately.

Commands

Every line has to start with a command statement, followed by a list of parameters for the command. Possible commands are:

  • INIT: Initialize the simulation domain.
  • GEOMETRY <GeometryType>: Create or import a geometry. Possible options for creating geometries are: Trench, Hole and Plane. It is also possible to import geometries from .lvst files by specifying Import or to import layers from GDSII file format by specifying GDS (only possible in 3D mode). Parameters for the geometries are described below.
  • PROCESS <ProcessType>: Run a process. Possible process types are: Deposition, GeometricUniformDeposition, SF6O2Etching and DirectionalEtching. Parameters for the processes are described below.
  • PLANARIZE: Planarize the geometry at a given height.
  • OUTPUT <fileName>: Print the surface of the geometry in fileName.vtp file format.

Parameters

Every parameter is specified by paramName=paramValue (there must not be any blank space before or after the = sign) after the command statement. All parameters which are parsed additional to a command are described below. For any parameter which is not specified, a default value is assigned.

INIT

xExtent
width of the domain in x-direction (numeric value, default: 1)
yExtent
width of domain in y-direction (this is ignored in 2D mode, numeric value, default: 1)
resolution
distance between grid points in the domain (numeric value, default: 0.02)
printTimeInterval
minimum time between outputting intermediate disk meshes for each process step. If this value is negative, no intermediate meshes will be printed (numeric value, default: 0)
periodic
use periodic boundary conditions (boolean, default: 0)

GEOMETRY Trench

width
width of the trench (numeric value, default: 0.2)
depth
depth of the trench (numeric value, default: 0.5)
zPos
offset of the trench in z-direction (y-direction in 2D mode, numeric value, default: 0)
tapering
tapering angle of the trench in degrees (numeric value, default: 0)
mask
creates a mask from the trench, such that the bottom represents a different material and a selective etching or deposition process can be used (boolean, default: 0)

GEOMETRY Hole

radius
radius of the hole (numeric value, default: 0.2)
depth
depth of the hole (numeric value, default: 0.2)
zPos
offset of the hole in z-direction (y-direction in 2D mode, numeric value, default: 0)
tapering
tapering angle of the hole in degrees (numeric value, default: 0)
mask
creates a mask from the hole, such that the bottom represents a different material and a selective etching or deposition process can be used (boolean, default: 0)

GEOMETRY Plane

zPos
offset of the plane in z-direction (y-direction in 2D mode, numeric value, default: 0)

GEOMETRY Import

file
file name of ViennaLS geometry files. The file name is assumed to be appended with "_layer(i).lvst" (string, no default value)
layers
number of layers to read (integer value, default: 0)

GEOMETRY GDS

file
file name of GDSII file (string, no default value)
layer
specify which layer of the file should be read (integer value, default: 0)
maskHeight
height of the layer in z-direction (numeric value, default: 0.1)
zPos
offset of the layer in z-direction (numeric value, default: 0)
invert
invert the mask (boolean, default: 0)
xPadding
padding on the boundary of the mask in x-direction (numeric value, default: 0)
yPadding
padding on the boundary of the mask in y-direction (numeric value, default: 0)

PROCESS Deposition

time
process time (numeric value, default: 1)
rate
deposition rate (numeric value, default: 1)
sticking
sticking coefficient (numeric value, default: 1)
cosineExponent
Exponent for cosine distribution of initial ray directions (numeric value, default: 1)
raysPerPoint
number of rays traced per grid point in the surface geometry (integer value, default: 3000)

PROCESS SphereDistribution

radius
radius used for sphere distribution (numeric value, default: 1, can be negative for etching)

PROCESS BoxDistribution

halfAxisX
half the width of the box in x-direction (numeric value, default: 1, can be negative for etching)
halfAxisY
half the width of the box in y-direction (numeric value, default: 1, can be negative for etching)
halfAxisZ
half the width of the box in z-direction (numeric value, default: 1, can be negative for etching)

PROCESS SF6O2Etching

time
process time (numeric value, default: 1)
ionFlux
total flux of ions in plasma (numeric value, default: 2e16)
ionEnergy
mean ion energy in eV (numeric value, default: 100)
rfBias
rf bias in W (numeric value, default: 105)
etchantFlux
total flux of etchant species in plasma (numeric value, default: 4.5e16)
oxygenFlux
total flux of oxygen in plasma (numeric value, default: 1e18)
A_O
factor for ion etching yield on oxygen (numeric value, default: 3)
raysPerPoint
number of rays traced per grid point in the surface geometry (integer value, default: 3000)
maskId
ID of mask material (integer value, default: 0)

PROCESS FluorocarbonEtching

time
process time (numeric value, default: 1)
ionFlux
total flux of ions in plasma (numeric value, default: 2e16)
ionEnergy
mean ion energy in eV (numeric value, default: 100)
plasmaFrequency
RF plasma frequency in MHz (numeric value, default: 0.1)
etchantFlux
total flux of etchant species in plasma (numeric value, default: 4.5e16)
oxygenFlux
total flux of oxygen in plasma (numeric value, default: 1e18)
temperature
reactor temperature in K (numeric value, default: 300)
raysPerPoint
number of rays traced per grid point in the surface geometry (integer value, default: 3000)
maskId
ID of mask material (integer value, default: 0)

PROCESS DirectionalEtching

time
process time (numeric value, default: 1)
direction
primal direction of etching (string, default: negZ, negY in 2D mode)
directionalRate
etching rate in primal direction (numeric value, default: 1)
isotropicRate
isotropic etching rate (numeric value, default: 0)
maskMaterial
mask material (string, default: Mask)

PROCESS Isotropic

time
process time (numeric value, default: 1)
rate
process rate, can be negative for etching (numeric value, default: 0)
material
deposited material if rate is positive (string, default: Undefined)
maskMaterial
mask material (string, default: Mask)

PLANARIZE

height
height of planarization on the z-axis (y-axis in 2D, numeric value, default: 0)